“If you are creating high value hermetically sealed devices, what are the consequences of experiencing high voids in the package seal ring?”
High levels of voids in the package seal ring may cause leak failures, which in turn can decrease the reliability and performance of your device. It may result in a short device lifetime and /or premature failure, or may cause some unforeseen damage to the end use product. For the best product performance and longevity, a void free seal is highly desirable.
So, how can we minimize voids in package seal ring?
First, recall that the keys to a void free seal are:
- The quality of raw materials used
- Impurities in the preforms
- Cleanliness of components
- Prebake time
- Outgassing of materials and/or organic epoxies inside the seal cavity.
SST’s systems create hermetically sealed MEMS packages, such as IR sensors, gyroscopes, bolometers and accelerometers. Packages are required to be hermetically sealed to protect from all types of environmental conditions. All packages must pass the Fine and Gross Bubble Test according to the MIL SPEC 883 Method 1014 to be considered hermetically sealed. A Fine Leak Test must be performed first prior to Gross Bubble Test per MIL SPEC.