LEADERSHIP

SST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over twenty-five years, SST has provided flux-free and void-free soldering, brazing and glass sealing solutions to the world-wide electronics industry. SST’s team of leading engineers and technologists are constantly advancing the state-of-the-art in microelectronic package assembly techniques, processes and equipment.
  SERVING THESE INDUSTRIES:

• Telecommunications
• Semiconductor
• Photonics
• Electronics
• Automotive
• Defense
• Aerospace
• Optoelectronics
• Medical Device
• Research
 

WITH TURNKEY SYSTEMS FOR:

• Eutectic Die Bonding
• Flux-Less Solder Reflow
• MEMS Package Sealing
• Component Assembly
• Hermetic Package Sealing
• Getter Activation
• Glass Sealing
• Wafer Bonding
• Solder Ball Bumping
• Precision Thermal Profiling

SOLUTION-FOCUSED PARTNERSHIP

SST International is focused on forging partnerships with leading manufacturers to develop comprehensive solutions to their microelectronic package assembly needs. SST has provided turnkey manufacturing
systems to over 400 companies world-wide. These solutions are developed in close collaboration with customers to insure their goals are met. SST provides materials selection consulting, process development services, equipment and tooling design, system fabrication, installation, training and long-term support. Contact SST today to solve your package assembly challenges.

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