Void-free die and substrate solder attach is used to create a uniform thermal interface for high reliability microelectronic devices.
Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.
Wafer level packaging processes include solder reflow, lid sealing, anodic bonding, direct fusion, adhesive and glass frit.
Glass to metal sealing is performed at high temperatures to created hermetic seals for electrical feedthroughs and electronic components.
High vacuum discrete MEMS package sealing requires baking to remove moisture, high temperature getter activation and hermetic lid sealing.
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