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Hermetic Package Sealing

Hermetic package sealing processes with solder or glass frit are used to isolate critical microelectronic circuits from the surrounding environment. Hermetic packaging materials are usually ceramic or metal and are sealed with a metal solder or solder-glass joint. This keeps moisture and other corrosive contaminants from damaging components and wire bond connections. Using fixtures which precisely locate package components, and applying precise thermal profiles in vacuum and positive inert gas pressures, SST's equipment creates an hermetic seal between the package seal ring and the lid which will meet the requirements of MIL-STD-883. Typical applications include the manufacture of military electronics, space-rated components, implantable medical devices, precision timing circuits and micro-electro-mechanical systems (MEMS).

  • Ceramic LCC to Kovar Lid Hermetic Solder Seal
  • Microwave Package with Ceramic Lid in Graphite Sealing Fixture
  • Ceramic to Sapphire Hermetic Package Solder Seal
  • Ceramic Side Braze DIP to Kovar Lid Hermetic Solder Seal

Systems

Model 1200 Table Top Furnace

Model 1200 Table Top Furnace is used for process development and low volume production soldering of microelectronic packages and components.

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Model 3150 High Vacuum Furnace

Model 3150 High Vacuum Furnace is used for activating getters, sealing of discrete MEMS packages and other sealing and brazing processes.

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Model 5100 Vacuum Pressure Furnace

Model 5100 Vacuum Pressure Furnace is used for high production void-free soldering of microelectronic packages and components.

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Model 3130 Vacuum Pressure Furnace

Model 3130 Vacuum Pressure Furnace is used for production soldering, glass sealing and brazing of microelectronic packages and components.

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Model AVS-4000 Automated High Vacuum Furnace

Model AVS-4000 Automated High Vacuum Furnace is used for high vacuum sealing of MEMS packages and other automated soldering processes.

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Model 3250 High Vacuum Wafer Furnace

Model 3250 High Vacuum Wafer Furnace is used for high vacuum soldering and bonding of components and wafers up to 8-inch (200 mm) diameter.

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Applications

  • Automotive Sensors
  • Gated Light Arrays
  • Glass Diodes
  • Hermetic Feed-Throughs
  • Implantable Medical Devices
  • Microwave Packages
  • Miniature Crystals
  • Miniature Fuses
  • Miniature Lamps
  • Oscillators
  • Pacemakers
  • Pressure Sensors
  • Reed Switches
  • RF Amplifiers