Hermetic package sealing processes with solder or glass frit are used to isolate critical microelectronic circuits from the surrounding environment. Hermetic packaging materials are usually ceramic or metal and are sealed with a metal solder or solder-glass joint. This keeps moisture and other corrosive contaminants from damaging components and wire bond connections. Using fixtures which precisely locate package components, and applying precise thermal profiles in vacuum and positive inert gas pressures, SST's equipment creates an hermetic seal between the package seal ring and the lid which will meet the requirements of MIL-STD-883. Typical applications include the manufacture of military electronics, space-rated components, implantable medical devices, precision timing circuits and micro-electro-mechanical systems (MEMS).