Void-free die and substrate soldering, also known as eutectic die attach, is key to the reliability of many advanced microelectronic products. This assembly process is used when heat must be transferred away from the die or other critical components to avoid thermal failure. The presence of voids increases the die operating temperature by inhibiting efficient heat transfer through the thermal interface material (TIM). Voids may be created by flux residue, surface oxides, trapped gas and poor wetting. SST's equipment and processes minimize voids through the precise control of vacuum levels, positive pressures and thermal profiles. Typical applications include the manufacture of monolithic microwave integrated circuits (MMICs), high power semiconductor modules, concentrated photovoltaic (CPV) solar cells, laser pump diodes, automotive rectifier diodes and microwave amplifiers.