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Void-Free Die Soldering

Void-free die and substrate soldering, also known as eutectic die attach, is key to the reliability of many advanced microelectronic products. This assembly process is used when heat must be transferred away from the die or other critical components to avoid thermal failure. The presence of voids increases the die operating temperature by inhibiting efficient heat transfer through the thermal interface material (TIM). Voids may be created by flux residue, surface oxides, trapped gas and poor wetting. SST's equipment and processes minimize voids through the precise control of vacuum levels, positive pressures and thermal profiles. Typical applications include the manufacture of monolithic microwave integrated circuits (MMICs), high power semiconductor modules, concentrated photovoltaic (CPV) solar cells, laser pump diodes, automotive rectifier diodes and microwave amplifiers.

  • MMIC Soldered Void-Free on Heat Spreader Tab
  • CPV Solar cell, diode and connectors soldered to ceramic substrate
  • Hybrid Power Module Void-Free Soldering
  • Power die void-free soldered into LCC Package
   Download the Whitepapers:
Void-Free/Flux-Free Whitepaper Plating Requirements Whitepaper
New Call-to-action Plating Requirements for Soldering Applications


Systems

Model 1200 Table Top Furnace

Model 1200 Table Top Furnace is used for process development and low volume production soldering of microelectronic packages and components.

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Model 3150 High Vacuum Furnace

Model 3150 High Vacuum Furnace is used for activating getters, sealing of discrete MEMS packages and other sealing and brazing processes.

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Compare 3130 vs 3150

Model 3130 Vacuum Pressure Furnace

Model 3130 Vacuum Pressure Furnace is used for production soldering, glass sealing and brazing of microelectronic packages and components.

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Model 5100 Vacuum Pressure Furnace

Model 5100 Vacuum Pressure Furnace is used for high production void-free soldering of microelectronic packages and components.

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Applications

  • Accelerometers
  • Automotive Diodes
  • CPV Solar Cell Modules
  • Fiber Optic Devices
  • Flip Chips
  • GaN MMIC's
  • Hearing Aid Amplifiers
  • High Accuracy Gyroscopes
  • Implantable Medical Devices
  • Laser Pump Diodes
  • LED Lamps and Heaters
  • MEMS Devices
  • Microwave Packages
  • MMIC's
  • Power Modules
  • RF Amplifiers