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Wafer Level Packaging and Wafer Bonding

Wafer Level Packaging (WLP) provides for both interconnection and package sealing of circuits at the wafer level. Processes include flip chip solder reflow, solder lid sealing and wafer-to-wafer bonding using solder, glass, adhesives and direct fusion. SST has developed a variety of wafer level packaging solutions which may be applied to many different product applications. Precision alignment, uniform thermal heating up to 1000°C, high vacuum levels and high bonding forces each may be utilized as required.

  • Model 1500 Wafer Alignment for Wafer Bonding (WLP)
  • Wafer Alignment Jig for 150 mm Wafer Bonding (WLP)
  • 150 mm Wafer to Wafer Bonding in Process Chamber (WLP)
  • 150 mm Glass to Silicon Bonded Wafer Stack (WLP)

Systems

Model 1500 Wafer Aligner

Model 1500 Wafer Aligner is used for precise alignment of wafers up to 200 mm in diameter.

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Model 3190 High Vacuum Wafer Bonder

Model 3190 High Vacuum Wafer Bonder is used for bonding wafers under high vacuum, high temperature and with a high mechanical bonding force

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Model 3180 Wafer Bonder

Model 3180 Wafer Bonder is used for bonding wafers at high temperatures, under vacuum or inert gas, with a high mechanical bonding force.

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Model 3250 High Vacuum Wafer Furnace

Model 3250 High Vacuum Wafer Furnace is used for high vacuum soldering and bonding of components and wafers up to 8-inch (200 mm) diameter.

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Applications

  • Accelerometers
  • Automotive Sensors
  • Flip Chips
  • Gated Light Arrays
  • MEMS Devices
  • Microwave Crystals
  • Pressure Sensors