VACUUM / PRESSURE FURNACES

SST INTERNATIONAL OFFERS SEVERAL MODELS OF VACUUM/PRESSURE FURNACES FOR FLUX-FREE, VOID-FREE SOLDERING, BRAZING AND GLASS SEALING

Model 1200 Table Top Solder Reflow Station
• Ideal for low volume, high reliability hermetic package
  sealing, eutectic die attach, process development and   university research.

Model 3130 Vacuum/Pressure Furnace
• The industry standard for flux-free, void-free solder
  assembly of hybrids, fiber optic packages, power devices,
  BGA devices, plus high temperature glass sealing and
  brazing processes.

Model 3140 and 3150 High Vacuum Furnaces
• High vacuum thermal processing furnaces used for
  MEMS package sealing, getter activation and very high
  reliability, low moisture hermetic package sealing.

Model 5100 Vacuum/Pressure Soldering Furnace
• Large format programmable vacuum/pressure soldering
  furnace ideally suited for producing high volume
  microelectronic components and packages.

Model PF-2400 High Volume Production Furnace
• Designed for high volume, void-free, vacuum soldering
  of devices such as high power rectifiers, large hybrid
  modules and BGA panels.