MODEL 3180/3190 - WAFER BONDERS
FOR HIGH RELIABILITY WAFER BONDING

Models 3180 and 3190 are programmable wafer bonders offered by SST International for high-reliability bonding of silicon, gallium-arsenide and glass wafers up to 6 inches (150 mm) in diameter.

Both systems provide precise automatic control of heating and cooling at temperatures up to 500 °C (1000 °C optional). Bellows actuated clamping platens present uniform mechanical bonding forces up to 750 pounds (5,000 pounds optional) to the wafer pair.  The 3190 also provides anodic (electrostatic) bonding capabilities with a user-selected high-voltage power supply and chamber feed-through. Vacuum levels down to 50 millitorr are provided in the 3180 by a two-stage mechanical pump. Vacuum levels below 1 x 10-6 torr are provided in the 3190 by a cryogenic vacuum pumping system combined with a dry mechanical forepump. Digital vacuum level gauging is provided to monitor and control vacuum levels. Machine control is provided by an embedded control system operating in a Microsoft Windows® environment. An unlimited number of process profiles can easily be created and stored in the controller. Run data is archived for quality control and off-line data analysis. Internet and intranet network connectivity is available as an option, permitting remote monitoring, troubleshooting and maintenance capabilities.

TYPICAL APPLICATIONS:

  

• Silicon to Glass Wafer Bonding
• Anodic Wafer Bonding
• Eutectic Wafer Bonding

• MEMS Wafer Bonding
• Pressure Sensor Bonding
• High Temperature/Pressure Glass Flow

CONTROL SYSTEM

Models 3180 and 3190 utilize distributed logic systems that link intelligent temperature and pressure controllers to a Microsoft Windows® based central control. All process parameters are controlled automatically with user-edited programs for each application. Multiple temperature ramp and soak cycles, vacuum and pressure cycling, mechanical wafer clamping force and anodic power supply settings are easily programmed as time-based events. Furnace operating characteristics are continuously monitored and the operator is alerted to any fault conditions. The operator interface features a color touch-screen display and PC keyboard. All process file results, including ultimate vacuum levels, are stored directly on the system hard drive.

Process Chamber


SELECTED 3180/3190 OPTIONS

  • Custom Graphite Tooling
  • Extended Temperature Range
    (1000 °C)
  • High Clamping Force (5,000 pounds)
  • Residual Gas Analyzer (RGA)
  • Multiple Zone Temperature Recording
  • Moisture Level Recording
  • Internet Connectivity
  • Cooling Water Chiller/Pump
  • Light Tree
  • Color Inkjet Printer

Color Touch-Screen Display

SPECIFICATIONS*

 
3180
3190
Vacuum Pump Type
Mechanical
Cryogenic
Minimum Vacuum Level
50 millitorr (.065 mbar)
1 x 10-6 torr (1 x 10-6 mbar)
Operating Temperature Range
RT to 500 °C (1000 °C option)
Thermal Work Zone
6 in (150 mm) diameter
Adjustable Mechanical Clamping Force
0 - 750 lb (0 - 3 kN) or 0 - 5,000 lb (0 - 20 kN) option
Maximum Chamber Gas Pressure Level
50 psig (4.5 bar)
15 psig (2 bar)
Process Gasses
(three inputs)
N2 required, (Ar, He, forming gas optional) @ 90 psig (7 bar) minimum pressure
Electrical Service
208-240 volts, 60 amps, 60/50 Hz, 1 phase, 5 kilowatt average, 15 kilowatt peak
Cooling Water Required
2 GPM (8 lpm) @ 20-25 °C, 2 kilowatt capacity minimum
Compressed Air Required
90 psig (7 bar), ¼ in (6.5 mm) inside diameter line
Overall Size
(W x D x H)
58 x 54 x 53 in
(147 x 137 x 135 cm)
94 x 54 x 53 in
(239 x 137 x 135 cm)
Helium Compressor Size (W x D x H)
not applicable
20 x 22 x 17 in
(50 x 57 x 43 cm)
Total Weight
1400 lb (650 kg)
2400 lb (1100 kg)

* Specifications subject to change

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