Model 1200 Table Top Furnace is used for process development and low volume production soldering of microelectronic packages and components.
Model 518 Vacuum/Pressure Furnace provides the right combination of performance and value for use in R&D labs to high mix/low volume production environments.
Model 5100 Vacuum Pressure Furnace is used for high production void-free soldering of microelectronic packages and components.
Model 3130 Vacuum Pressure Furnace is used for production soldering, glass sealing and brazing of microelectronic packages and components.
Model 3150 High Vacuum Furnace is used for activating getters, sealing of discrete MEMS packages and other sealing and brazing processes.
Model 3180 Wafer Bonder is used for bonding wafers at high temperatures, under vacuum or inert gas, with a high mechanical bonding force.
Model 3190 High Vacuum Wafer Bonder is used for bonding wafers under high vacuum, high temperature and with a high mechanical bonding force
Model 3250 High Vacuum Wafer Furnace is used for high vacuum soldering and bonding of components and wafers up to 8-inch (200 mm) diameter.
Model 1500 Wafer Aligner is used for precise alignment of wafers up to 200 mm in diameter.
Model AVS-4000 Automated High Vacuum Furnace is used for high vacuum sealing of MEMS packages and other automated soldering processes.
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