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SST Vacuum Reflow Systems

Model 1200 Table Top Furnace

Model 1200 Table Top Furnace is used for process development and low volume production soldering of microelectronic packages and components.

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Model 518 Vacuum/Pressure Furnace

Model 518 Vacuum/Pressure Furnace provides the right combination of performance and value for use in R&D labs to high mix/low volume production environments. 

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Model 5100 Vacuum Pressure Furnace

Model 5100 Vacuum Pressure Furnace is used for high production void-free soldering of microelectronic packages and components.

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Model 3130 Vacuum Pressure Furnace

Model 3130 Vacuum Pressure Furnace is used for production soldering, glass sealing and brazing of microelectronic packages and components.

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Model 3150 High Vacuum Furnace

Model 3150 High Vacuum Furnace is used for activating getters, sealing of discrete MEMS packages and other sealing and brazing processes.

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Model 3180 Wafer Bonder

Model 3180 Wafer Bonder is used for bonding wafers at high temperatures, under vacuum or inert gas, with a high mechanical bonding force.

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Model 3190 High Vacuum Wafer Bonder

Model 3190 High Vacuum Wafer Bonder is used for bonding wafers under high vacuum, high temperature and with a high mechanical bonding force

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Model 3250 High Vacuum Wafer Furnace

Model 3250 High Vacuum Wafer Furnace is used for high vacuum soldering and bonding of components and wafers up to 8-inch (200 mm) diameter.

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Model 1500 Wafer Aligner

Model 1500 Wafer Aligner is used for precise alignment of wafers up to 200 mm in diameter.

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Model AVS-4000 Automated High Vacuum Furnace

Model AVS-4000 Automated High Vacuum Furnace is used for high vacuum sealing of MEMS packages and other automated soldering processes.

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