Model 518 Vacuum/Pressure Furnace

The Model 518 Vacuum/Pressure furnace provides the right combination of performance and value for use in R&D labs to high mix/low volume production environments. Void-free, flux-free solder joints are reliably obtained through a carefully controlled and sequenced combination of heat, vacuum, and pressurized inert gas.

Download the Data SheetModel 518 Vacuum Pressure Furnace

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Void-Free Die Soldering

Void-free die and substrate solder attach is used to create a uniform thermal interface for high reliability microelectronic devices.

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Hermetic Package Sealing

Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.

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  • Void-Free Eutectic Die Attach
  • Flux-Free Solder Process Development
  • Assembly of High Reliability Microelectronic Packages
  • Hybrid Microelectronic Circuit Assembly
  • Fiber Optic Package Assembly
  • Ceramic Package Sealing



Opearting Temperature Range 100 to 500°C
Thermal Work Zone 9 x 9 in (230 x 230mm)
Minimum Vacuum Level 50 millitorr 
Maximum Gas Pressure Level 40 psig (3.7 bar)
Process Gasses N2 plus one option inert gas
Electrical Service 8.1 kW maximum, 50 or 60 Hz, 110-120v; 380 volt 3 phase
Chamber Depth 4 in (100 mm)
Temperature uniformity <+/- 1%
Overall Size (W x D x H) 40 x 35 x 42 in (102 x 89 x 107 cm)
Weight 800 lb (360 kg)

*Specifications are subject to change.