The key to a reliable thermal package assembly process is an optimized furnace profile. Properly selecting and combining the right environmental conditions at the correct times will create a process that produces high quality parts with high yields. Small adjustments to variables can often lead to significant improvements in your process.

SST International’s engineers are extremely familiar with the conditions required to produce high-reliability microelectronic packages and can assist you with developing or optimizing your furnace profile. For new profile development, refer to the sample profiles in the applications section of your SST furnace user manual, or contact us with your requirements. For existing profile optimization, please forward us a printout of your current profile.