Model 3250 High Vacuum Wafer Furnace



Model 3250 High Vacuum Wafer Furnace

The Model 3250 is a high vacuum multi-atmosphere furnace that has been designed for soldering and bonding components and wafers up to 8-inch (200 mm) diameter. The system is fully operational at vacuum levels of 10-7 Torr and pressures up to 12 psig with automatic selection and control of up to three process gasses. A closed-loop electronic pressure controller with integral capacitance manometer provides fine control of pressure and flow throughout the full operating range of the system. The heating system provides high uniformity thermal profiles up to 350°C.



Specifications
Datasheet
Processes
Applications

The Model 3250 is a high vacuum multi-atmosphere furnace that has been designed for soldering and bonding components and wafers up to 8-inch (200 mm) diameter. The system is fully operational at vacuum levels of 10-7 Torr and pressures up to 12 psig with automatic selection and control of up to three process gasses. A closed-loop electronic pressure controller with integral capacitance manometer provides fine control of pressure and flow throughout the full operating range of the system. The heating system provides high uniformity thermal profiles up to 350°C.

Vacuum Pump Type Turbomolecular Drag (optional Cryogenic Water Pump)
Minimum Vacuum Level 1 x 10-7 torr (1 x 10-7 mbar)
Operating Temperature Range RT to 350°C
Thermal Work Zone Up to 8 inch (200 mm) diameter
Maximum Chamber Gas Pressure Level 12 psig (1.8 bar)
Process Gasses (three inputs) N2 required, (Ar, He, forming gas optional) @ 90 psig (7 bar) minimum pressure
Electrical Service 208-240 volts, 60 amps, 50/60 Hz, 3 phase, 6.5 kilowatt average, 23 kilowatt peak
Cooling Water Required 5 gpm (19 lpm) @ 20-25°C, 5 kilowatt capacity minimum
Compressed Air Required 90 psig (7 bar)
Work Surface Height 37 in (95 cm) adjustable
Overall Size (W x D x H) 94 x 43 x 54 in (238 x 109 x 137 cm)
Total Weight 2000 lb (910 kg)

Specifications are subject to change.

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