Model 3250 High Vacuum Wafer Furnace
The Model 3250 is a high vacuum multi-atmosphere furnace that has been designed for soldering and bonding components and wafers up to 8-inch (200 mm) diameter. The system is fully operational at vacuum levels of 10-7 Torr and pressures up to 12 psig with automatic selection and control of up to three process gasses. A closed-loop electronic pressure controller with integral capacitance manometer provides fine control of pressure and flow throughout the full operating range of the system. The heating system provides high uniformity thermal profiles up to 350°C.
The Model 3250 is a high vacuum multi-atmosphere furnace that has been designed for soldering and bonding components and wafers up to 8-inch (200 mm) diameter. The system is fully operational at vacuum levels of 10-7 Torr and pressures up to 12 psig with automatic selection and control of up to three process gasses. A closed-loop electronic pressure controller with integral capacitance manometer provides fine control of pressure and flow throughout the full operating range of the system. The heating system provides high uniformity thermal profiles up to 350°C.
Vacuum Pump Type | Turbomolecular Drag (optional Cryogenic Water Pump) |
Minimum Vacuum Level | 1 x 10-7 torr (1 x 10-7 mbar) |
Operating Temperature Range | RT to 350°C |
Thermal Work Zone | Up to 8 inch (200 mm) diameter |
Maximum Chamber Gas Pressure Level | 12 psig (1.8 bar) |
Process Gasses (three inputs) | N2 required, (Ar, He, forming gas optional) @ 90 psig (7 bar) minimum pressure |
Electrical Service | 208-240 volts, 60 amps, 50/60 Hz, 3 phase, 6.5 kilowatt average, 23 kilowatt peak |
Cooling Water Required | 5 gpm (19 lpm) @ 20-25°C, 5 kilowatt capacity minimum |
Compressed Air Required | 90 psig (7 bar) |
Work Surface Height | 37 in (95 cm) adjustable |
Overall Size (W x D x H) | 94 x 43 x 54 in (238 x 109 x 137 cm) |
Total Weight | 2000 lb (910 kg) |
Specifications are subject to change.
Download Datasheet for Model 3250 High Vacuum Wafer Furnace
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