High Vacuum MEMS Package Sealing

Certain advanced micro-electro-mechanical systems (MEMS) devices require internal package vacuum levels on the order of 1 millitorr over the life of the device. Sealing of these MEMS packages requires specialized thermal processing in a high vacuum system. Hermeticity, gas permeation, surface desorption and hydrogen diffusion must all be taken into account. Non-evaporable getters must be properly selected and integrated into the device to maintain the required vacuum levels. SST is the world leader in the development and implementation of processes and equipment for sealing of discrete high vacuum MEMS packages. These provide the ability to fully activate getters at high temperatures in a high vacuum while isolating temperature sensitive components from damaging heat. Typical applications include infrared micro-bolometers, high precision gyroscopes and inertial rate sensors, and advanced ultra-precision timing devices.